these were the two most interesting parts to me. first one deals with operating the device at a lower voltage, and the second has to do with input impedance.
1. "When forward biased with a constant gate voltage, the quiescent drain current will rise as the temperature of the die increases. Operating at the typical drain voltage for these parts, about one third of the rated BVdss, the power dissipation due to the increasing Idq results in “hot spotting” and subsequent thermal runaway. This is an unstable system. The dissipation increases so rapidly that the outside surface of the case does not follow the internal junction temperature. As a result, a bias compensation scheme that uses temperature sensing cannot keep up with the Vth shift and the device is destroyed. The power dissipation within the die is a direct function of the operating voltage. By lowering the operating voltage the thermal loop gain can be reduced to a point where the gate threshold shift can be compensated for. Thermal stability can be achieved by sensing the case temperature. Linear operation thus becomes practical at 100V and below. While this is less than 25% of the rated BVdss and results in less gain, a very rugged and useful linear amplifier results."
2. " In an ideal MOSFET, the input impedance is a pure capacitor. It has no real part. At 50 MHz the ARF448 has an input impedance of just 0.2 + j 0.5. This indicates that the impedance of the bonding wire inductance is slightly larger than the gate capacitance and that there is very little gate loss resistance. It also suggests that careful attention to the design of the input matching network will be necessary to obtain the design goals."
i have lots more reading to do before i really understand any of this.
LC